TI announced that it would add another 12-inch wafer factory to merge with the existing factory

According to MarketWatch, on Wednesday local time, Texas Instruments, a semiconductor design and manufacturing company, said that it would build a second 300 mm semiconductor wafer manufacturing plant in Leahy, Utah, USA, which is part of the company's $11 billion (currently about 75.35 billion yuan) investment in Utah. It is expected to start construction in the second half of 2023 and put into production as early as 2026. The new factory will manufacture tens of millions of analog and embedded processing chips every day, which are widely used in various electronic products fields in the global market.

The plant is close to the existing 12-inch wafer manufacturing plant LFAB of Texas Instruments in the region. After completion, the two plants will be combined into one wafer manufacturing plant for operation. The new wafer factory will create about 800 additional jobs and thousands of indirect jobs for Texas Instruments.

Haviv Ilan, the current executive vice president and chief operating officer who will take over the president and chief executive officer of Texas Instruments, said: "This new factory is part of our long-term plan for 12-inch wafer capacity to meet the needs of customers in the coming decades. The demand for semiconductors in electronic products, especially in the industrial and automotive markets, is expected to continue to grow in the future. Now is the best time for us to further expand our own manufacturing capacity."

It is reported that the plant will be designed according to the LEED gold certification standard, which is one of the LEED building rating standards in terms of structural efficiency and sustainable development. The water reuse rate of the new plant is estimated to be nearly twice that of the existing plant in Lihai. By adopting advanced 12-inch wafer manufacturing equipment and technology, the new plant will further reduce waste emissions and reduce water and energy consumption.