What are the cooling methods for electronic products? Analysis of heat dissipation methods for components

The performance of electronic products is becoming increasingly strong, and the continuous improvement of integration and assembly density has led to a sharp increase in their working power consumption and calorific value. According to statistics, the invalid materials of electronic components due to heat concentration account for about 65% -80% of the Failure rate, and the heat pipe theory is an important factor to be considered for electronic equipment. In this regard, it is necessary to strengthen the thermal control of electronic components. To help you comprehensively understand, this article will summarize the relevant knowledge of electronic component heat dissipation methods. If you are interested in the content to be covered in this article, please continue reading.

The efficient heat removal of electronic components is affected by heat transfer and Fluid mechanics. The heat removal of electrical equipment is to control the operating temperature of electronic products to ensure their working temperature and safety, mainly including differences in heat removal, materials, and other aspects. At present, the heat removal of electronic components mainly includes natural, forced, liquid, cooling, dredging, thermal protection, and other forms.

Natural heat removal or cooling

The natural heat removal or cooling method is under natural conditions and does not accept the influence of any external auxiliary energy. According to the local heating device, the temperature is controlled in the form of heat removal from the surrounding environment. Its core method is heat transfer, convection and radiation concentration method, which is mainly used for convection and its Natural convection.

The natural heat removal or cooling method is mainly used for electronic components with lower temperature control regulations and low-power devices and components with lower heat flux density. If other refrigeration technologies are not required, this method can also be used for sealed and densely assembled equipment.

In some cases, according to the low requirements for heat removal capacity, the influence of heat transfer or radiation between the electronic equipment and the adjacent heat sink can also be properly adjusted by the characteristics of the electronic equipment itself, and Natural convection can be improved by optimizing the structure, so as to improve the heat removal capacity of the system.

Forced heat removal or cooling

Forced heat removal or cooling is a method of using fans and other forms to accelerate the air flow around electronic components, thereby bringing heat. This method is relatively simple and convenient, with obvious application effects. This method can be used in electronic components if the space is larger, making it easier for gas to flow, or installing some heat removal equipment. In combination with the actual situation, the main methods to improve the convective heat transfer capacity are as follows: properly adjust the total heat removal area to generate relatively large convective Heat transfer coefficient on the heat removal surface.

Widely used in combination with practical situations to increase the heat dissipation area of the radiator surface. In engineering, the key is to expand the surface area of the radiator in the form of fins, thereby enhancing the heat transfer effect. The heat dissipation methods of fins can be divided into different methods, including heat exchange equipment used on the surface of some heat consuming electronic devices and heat exchange equipment used in the air. This method can reduce heat sink and thermal resistance, and improve its heat dissipation effect.

For some electronic devices with relatively high power, they can be solved in the form of aviation turbulence. By adding a spoiler in the radiator and introducing the turbulence into the surface flow field of the radiator, the heat transfer effect can be improved.

Naturally, the selection of materials for the radiator itself directly affects its heat dissipation performance. At present, the main material for radiators is aluminum die-casting with folded fins/stamped thin fins, which have the advantages of high thermal conductivity (198W/mK) and low oxidation resistance.

In addition, heat sinks made of AIN ceramics with a conductivity exceeding 200W/mk have the advantages of high thermal conductivity, non conductivity, and long-term exposure to air without oxidation. These materials have been applied to packaging technology for electronic components and corrugated pipes.

In addition, heat sinks made of silicon materials have been widely used in small systems, and ideal aspect ratio microchannels have been obtained on silicon materials through chemical processing methods.

Liquid cooling or heat dissipation methods

Solving the heat dissipation problem of electronic components through liquid cooling is a heat dissipation method based on chips and their components. The key to liquid cooling can be divided into direct cooling and indirect cooling. The indirect liquid cooling method utilizes auxiliary devices such as liquid modules, heat transfer modules, injection liquid modules, and their liquid substrates to conduct heat conduction between thermal components, rather than directly contacting electronic components. Indirect liquid cooling method is to use liquid coolant without direct contact with electronic components.

Direct liquid cooling method, also known as penetration cooling method, refers to the contact with liquid and related electronic components, which brings heat according to the cooling liquid. It is mainly used for equipment with relatively high volume density of some heat or used at high temperatures.

Heat removal or cooling in the form of cooling

According to the heat removal or refrigeration form of refrigeration, there are two main forms of refrigerant change: refrigeration and Pcltier refrigeration. In different environments, its form also varies, and it should be used reasonably according to the actual situation.

1. Changes in refrigerant refrigeration

It is a method of absorbing a large amount of heat based on the changing effect of the refrigerant, which can cool electronic devices in certain specific places. Generally speaking, the key is to utilize the heat generated by refrigerant evaporation in the environment, which includes capacity combustion and flow combustion at its core.

Generally speaking, deep cooling technology also has important value and influence in the refrigeration of electronic components. Deep cooling technology can be used in some relatively high-power computer software, which not only improves cycle efficiency, but also has a wide range of cooling quantities and environmental temperatures. The entire mechanical equipment structure is relatively compact, and the circulation efficiency is relatively high.

2. Pcltier cooling

Using semiconductor refrigeration to heat or cool some conventional electronic components has the advantages of small equipment size, easy installation, good quality, and easy disassembly.

This method, also known as thermoelectric refrigeration method, utilizes the Pcltier effect of semiconductor devices themselves to generate DC couples through different semiconductor devices and generate them in series. At this point, the cooling effect can be achieved by absorbing and releasing heat on both sides of the thermocouple.

This method is an industrial refrigeration method that generates negative thermal resistance, with relatively high stability. However, due to its relatively high cost and low efficiency, it is only used in environments with relatively compact volumes and low refrigeration regulations. Its heat removal temperature is ≤ 100 ℃; Cooling load ≤ 300W.

Heat removal or cooling in the form of kinetic energy dredging

It uses heat transfer components to transfer electronic devices to another environment. However, in the process of electronic circuit integration, high-power electronic devices gradually increase, and the size of electronic devices becomes smaller and smaller, which requires the heat dissipation equipment itself to have a certain heat removal standard.

Due to the inherent heat transfer characteristics, plasticity of heat flux density, and temperature control characteristics of heat pipe technology, it can quickly adapt to the environment and is widely used in the heat removal of electronic and electrical equipment. It can effectively meet the flexible, efficient, and reliable characteristics of heat dissipation equipment. Currently, it is widely used in the heat removal level of electrical equipment, electronic component refrigeration, and semiconductor equipment.

Heat pipe is an efficient heat transfer method widely used for heat removal in electronic components. Based on the actual situation, it is necessary to independently design the heat pipe according to different types of regulations, and to make a reasonable design by comparing the influence of gravity and its external forces on factors. In the process of heat pipe design, materials, processes, and cleanliness should be analyzed, product quality should be strictly controlled, and temperature monitoring issues should be addressed.

Thermal protection and heat dissipation methods

Thermal protection is a solution that utilizes insulation technology to achieve heat removal and cooling of electronic components. It is mainly divided into vacuum insulation and non vacuum insulation. Non vacuum insulation solutions are mainly used for temperature control of electronic components. Non vacuum insulation is a kind of insulation material with low Heat transfer coefficient. This insulation method is also a form of capacity insulation, directly influenced by the thickness of the insulation material, and the physical parameters of the material's thermal conductivity are also directly related to its insulation effect.

The thermal isolation method mainly affects the temperature of some devices, strengthens the operation and organization of high-temperature devices and related objects, ensures the stability of the entire device, and improves the service life of the equipment. Based on the actual situation, due to the direct correlation between temperature and the heat transfer characteristics of insulation materials, generally higher temperatures result in more insulation materials.

At the same time, the increase of temperature will also increase the internal radiation in the Porous medium in the insulating material. When using insulation measures, if the machine runs for a relatively long time, the actual insulation effect will be worse. At the same time, if the temperature rises, the total Heat transfer coefficient of the porous insulation material itself will increase. In this regard, we must ensure the overall performance of the insulation material to improve its application effectiveness.

In the development process of integrated circuits, the density and thermal density of electronic components are also increasing, and their heat removal problems are gradually becoming prominent. In this regard, high-quality heat removal and cooling methods can ensure the performance parameters of electronic components.

Based on the actual situation, combined with the heating power and characteristics of specific electronic components, different heat removal and cooling methods and methods should be reasonably used, and the actual application site should be reasonably selected to highlight the performance parameters of electronic components.

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