Basic knowledge of integrated circuit packaging LCC packaging

Features of pinless package

The pinless package reduces the height during installation and is directly mounted in a square or rectangular shape. For heat dissipation, there is a large area of exposed pad in the center of the bottom of the package for heat conduction, which makes its size smaller than TSSOP, but its electrical performance is higher than TSSOP.

Common types of pinless package:

TQFN (Thin Quad Flat No-lead Package)

VQFN (Very-thin Quad Flat No-lead) Ultra-thin QFN

WQFN (Very Very-thin Quad Flat No-lead)

SON (Small Outline No-leads) small size package without pins. Compared with QFN, SON package only has electrode contacts on both sides,

Special classification and naming of LCC packaging:

JLCC (J-led Chip Carrier) LCC of J-pin

CLCC (Ceramic Leaded Chip Carrier) ceramic LCC with pins

C-LCC (Ceramic Leadless Chip Carrier),

P-LCC (Plastic Leadless Chip Carrier)

PLCC (Plastic Leaded Chip Carrier) plastic LCC with pins. It is a square, 32-pin package. The pins are led out from the four sides of the package in a T-shape. The overall size is much smaller than that of DIP package

You may be confused. In fact, in the past, PLCC and LCC (QFN) were differentiated according to materials. The former was plastic, and the latter was ceramic. But later, it was difficult to distinguish between the J-pin package using ceramic and the non-pin package using plastic. Therefore, the Japanese Electronics and Machinery Industry Association decided in 1988 to call the package with J-pin from four sides QFJ (now PLCC), and the package with electrode bumps on four sides QFN, It is now LCC.