What does packaging material mean? Integrated Circuit Chip Packaging Process Flow

Packaging materials refer to the use of glass, porcelain, and silicon in sensor manufacturing, including RTV, nickel, gold, aluminum, etc. Electronic packaging materials refer to load-bearing electronic components, interconnections, mechanical applications, sealing environmental protection, electronic component heat loss, and other functions. They have strong electrical insulation substrates and are the sealing of integrated circuits. Chips are the key to many electronic devices. In order to improve your understanding of chips, this article will introduce the packaging and production process of integrated circuit chips. To help you fully understand the following points, we will provide you with reference.

A chip is an integrated circuit composed of a large number of transistors. Different chips have different integration scales, ranging from hundreds of millions to hundreds of millions; From dozens to hundreds of transistors. There are two types of transistors: switches, represented by 1.0. Multiple 1 and 0 signals generated by multiple transistors are set to describe or solve specific functions (i.e. instructions and data) of letters, data, colors, and graphics. After the chip is powered on, Mr. Cheng starts the chip with a startup command, and then continues to receive new instructions and data to complete the function.

Introduction to Integrated Circuit Chip Packaging

Packaging concept: 1. Narrowly defined: Utilizing membrane technology and microfabrication technology to lay chips on structures or substrates. Paste cross connections, lead out wiring terminals, seal and fix them according to plastic insulation medium, and generate an overall three-dimensional structure.

2. Theory: Connect and fix the packaging body to the substrate, assemble it into a complete system or electronic product, and ensure the comprehensive performance of the entire system.

Chip packaging function:

1. Transmission function; 2. Transmission circuit signal; 3. Provide heat removal; 4. Structural protection and application.

Technical strength of packaging engineering:

Packaging engineering starts with pasting, fixing, interconnecting, packaging, sealing maintenance, connecting to circuit boards, system assembly, and continues until the finished product is completed.

The first layer, also known as chip layer packaging, refers to the adhesion and fixation between integrated circuit chips and packaging substrates or guides. The circuit connection and packaging maintenance process make it a module (component) component that is easy to access, place, transport, and can be assembled and connected to the next layer.

Second layer: The process of combining several packaging completed in the first layer with other electronic components to form a circuit card.

Layer 3: A component or subsystem on the main circuit board consists of several packaging and assembly circuit cards completed in the second layer.

Layer 4: The process of assembling multiple subsystems into a complete electronic device.

The connection process of integrated circuit components on chips is also known as zero level packaging, so packaging engineering can also be divided into five levels.

Packaging classification: 1. According to the packaging quantity of integrated circuit chips: single chip packaging (scp) multi chip packaging (MCP);

2. According to the sealing material: polymer material (plastic) and porcelain;

3. According to the interconnection method of the device and circuit board: pin insertion (PTH) and surface mount (SMT). 4. According to the distribution of pins: one side pin, two sides pin, four sides pin, and bottom pin;

SMT devices have L-type, J-type, and I-type metal pins.

SIP: SQP single column packaging: MCP small packaging: DIP packaging in metal cans: CSP double column packaging: QFP packaging chip size: PGA four sided flat packaging: BGA dot matrix packaging: LCC packaging in ball grid array: no wire ceramic chip medium.

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