Basic knowledge of integrated circuit packaging DIP packaging

What is DIP encapsulation?

The full English name of DIP is: Dual In-line Package is to arrange the pins on the two symmetrical sides of the integrated block, and adopt the direct plug-in pins. As the development of TO packaging, DIP packaging also inherits the characteristics of in-line.

Naming rules of DIP

There are many package names for DIP, such as common digital logic blocks: DIP8, DIP14, etc. The numbers behind them represent the number of pins of the package, such as DIP14, 14 represents the number of pins (7 pins on both sides).

DIP package type

DIP packaging can be divided into two categories according to different materials:

Plastic packaging (PDIP)

English name: Plastic Dual In-line Package

Plastic material, with simple process, light and thin, low cost, strong automation and productivity, is widely used in the environment with low external demand, but plastic packaging also has its disadvantages. Because of its use of plastic packaging, its heat dissipation and heat resistance are not as good as metal or ceramic materials, and the plastic sealing is not high, which is also easy to lead to external erosion.

Ceramic package (CDIP)

English name: Ceramic Dual In-line Package

Ceramic materials are extremely stable in terms of electrical, thermal and mechanical properties. Ceramic packaging can provide a good air-tight sealing protection for chips. However, compared with plastic packaging, ceramic materials are relatively brittle and vulnerable to external force damage. Moreover, the cost of ceramics is higher and the thickness is higher than that of plastic packaging, which makes it impossible to achieve ultra-thin plastic packaging.

Limitations of DIP packaging

DIP packaging began to be widely used in the 1960s and 1970s, but with the development of the industry, the internal frequency of the chip became higher and higher, and the function became stronger and stronger. The large size of DIP packaging and the number of pins were limited, and the pins were easy to be damaged during plugging and unplugging, which would no longer meet the needs of the chip, and would inevitably be replaced by other better forms of packaging.